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  ? semiconductor components industries, llc, 2011 february, 2011 ? rev. 4 1 publication order number: cm1248 ? 04qg/d CM1248-04QG low capacitance transient voltage suppressors / esd protectors features ? low i/o capacitance at 10 pf at 0 v ? in ? system esd protection to 15 kv contact discharge, per the iec 61000 ? 4 ? 2 international standard ? compact smt package saves board space and facilitates layout in space ? critical applications ? each i/o pin can withstand over 1000 esd strikes ? these devices are pb ? free and are rohs compliant marking diagram device package shipping ? ordering information udfn ? 6 qg suffix case 517bm http://onsemi.com cm1248 ? 04qg udfn ? 0.4 mm (pb ? free) 3000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. lr = specific device code lr block diagram cm1248 ? 04qg pin 1 pin 3 pin 6 pin 4 v n v n
cm1248 ? 04qg http://onsemi.com 2 top view 6 ? lead udfn (.4 mm) cm1248 ? 04qg pin 1 pin 2 pin 3 pin 6 pin 5 pin 4 package / pinout diagrams table 1. pin descriptions pins name description (refer to package / pinout diagrams) chx the cathode of the respective tvs diode, which should be connected to the node requiring transient voltage protection. (refer to package / pinout diagrams) v n the anode of the tvs diodes. specifications table 2. absolute maximum ratings parameter rating units storage temperature range ? 65 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. table 3. standard operating conditions parameter rating units operating temperature ? 40 to +85 c table 4. electrical operating characteristics (note 1) symbol parameter conditions min typ max units c in channel input capacitance t a = 25 c, 0 vdc, 1 mhz; note 2 10 pf 0 vdc, 1 mhz; note 1 7 15 pf  c in differential channel i/o to gnd capacitance t a = 25 c, 2.5 vdc, 1 mhz; note 2 0.19 pf v rso reverse stand ? off voltage i r = 10  a, t a = 25 c 5.5 v i r = 1 ma, t a = 25 c 6.1 v i leak leakage current v in = 5.0 vdc, t a = 25 c 0.25  a v in = 5.0 vdc, note 1 0.75  a v sig small signal clamp voltage positive clamp negative clamp i = 10 ma, t a = 25 c i = ? 10 ma, t a = 25 c 6.8 ? 0.89 v v esd esd withstand voltage contact discharge per iec 61000 ? 4 ? 2 standard t a = 25 c (notes 2, 4 and 5) 15 kv r d diode dynamic resistance forward conduction reverse conduction t a = 25 c (notes 2 and 3) 0.57 1.36  1. all parameters specified at t a = ? 40 c to +85 c unless otherwise noted. 2. these parameters guaranteed by design and characterization. 3. human body model per mil ? std ? 883, method 3015, c discharge = 100 pf, r discharge = 1.5 k  , v n grounded. 4. standard iec 61000 ? 4 ? 2 with c discharge = 150 pf, r discharge = 330  , v n grounded. 5. these measurements performed with no external capacitor on pin x .
cm1248 ? 04qg http://onsemi.com 3 performance information diode capacitance typical diode capacitance with respect to positive tvs cathode voltage (reverse voltage across the diode) is given in diode capacitance vs. reverse voltage. figure 1. diode capacitance vs. reverse voltage typical high current diode characteristics measurements are made in pulsed mode with a nominal pulse width of 0.7 ms. figure 2. typical input vi characteristics (pulse ? mode measurements, pulse width = 0.7 ms nominal)
cm1248 ? 04qg http://onsemi.com 4 package dimensions case 517bm ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. 0.10 c d e b a 2x 2x note 4 a a1 (a3) 0.10 c pin one reference 0.08 c 0.10 c c seating plane bottom view b e 6x 0.10 b 0.05 a c c l 6x side view top view note 3 1 3 4 6 6x 6x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* detail a dimension: millimeters recommended l1 detail a l alternate terminal constructions l ??? ?? 0.53 1.30 0.25 0.40 pitch package outline 1 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.15 ref b 0.15 0.25 d 1.25 bsc e 1.00 bsc e 0.40 bsc l 0.20 0.40 l1 ??? 0.15 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 cm1248 ? 04qg/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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